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Chip design resurges the wave. Taiwan voice module may become "sedan chairman"

News by ninechip | On 2018-11-20 08:54
Two weeks after the launch of Apple's new iPhone, the iPhone XS Max, Apple has always lived up to the expectations of the public as the leader of the communications industry. Only the $50,000-plus iPhone XS Max has been far more than expected, and the boom is evident. The latest report even points out that the expected demand for iPhone XS Max is 3 to 4 times that of iPhone XS.
   Ten years of development, the true meaning of soft and hard integration: even chips are planned by themselves
   At the Apple Product Publishing Conference in September, Apple introduced its A12 Bionic and highlighted it as the first mass-produced 7 nanometer processor.
    Since Apple launched its own So-C A4 in 2010, it has been acquiring chip planners through acquisitions. Now it's not just iPhone, even products like iPad, Mac and Apple Watch are all equipped with Apple's own  voice module. The wave led by Apple has also spread to other companies, from Google and Tesla to the miner Bit Continent, all on their own to plan their own chips, thoroughly manipulating the most central chip planning, software architecture platforms and hardware planning.
   Why do large voice module manufacturers start developing AI chips themselves?
   Ye Zhenxiu, senior industry analyst and group leader of MIC, analyzed that because AI chips require a lot of matrix operations, the original GPU is not efficient enough to use, and the demand for more customized chips. But there is no product on the market that can meet this demand, coupled with the IC planning is not as difficult as before, so large factories are more inclined to develop their own chips. And self-developed chips can also take away unnecessary functions from general-purpose chips, so the cost can be controlled more easily and so on.
    TSMC "upward management" becomes a direct competitor
    Moreover, before the era of straight integration arrives, it is likely that there will be a "quasi-straight integration" in which wafer OEMs such as TSMC may become "direct" competitors for IC planners.
   What is the quasi-straight integration? ETRON Technology Chairman Lu pointed out that the semiconductor industry chain upstream and downstream is more open and tighter, just like a company-style collaboration develops new products. And it is the best example that TSMC provides In-FO packaging skills and owns Apple order alone. TSMC's integrated fan-out (In-FO) encapsulation skills have led to superior results, allowing TSMC to defeat Samsung and take Apple orders alone. The chip-making side of TSMC and the user-side of Apple have enabled this skill to be successfully used in the iPhone through open and close collaboration.
    What does "direct" mean? Today, Apple and Google have to rely on TSMC's wafer maker to integrate the technology plant, and TSMC provides top-notch skills to help customers complete the process from IC planning to the production of test closure. This "upward (customer) management" technology has a direct impact on the IC planning plant.
  Industrial Research Institute: direct integration is a warning to Taiwan's  planning industry
    Since the launch of Apple's first iPhone in 2007, Taiwan's technology industry has been more active in discussing software and hardware integration, but only focusing on software and hardware planning and user experience. And it has become an important issue for Acer, Asus and HTC mobile phone and pen terminal or later Internet of Things brand operators. Taiwan's voice IC planners do not believe that such a trend is self-related, but more than a decade later, it does enter into the AI voice recognition chip era. The four words ¡°software and hardware integration¡± have a clearer summary. That is, integrate the resource until the chip are self-planning, and thus even the upstream IC planners have begun to be involved inside.
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