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Is Modular Small Chip and Sound Chip Module the Future Trend?

News by ninechip | On 2019-01-11 09:02
 In recent years, Moore's law seems to have met the bottleneck of development as the technology of sound chip module is getting closer and closer to the limit. In a recent interview with a magazine, Mark Paper-master, chief technology officer of AMD, said: "We see that Moore's Law is slowing down, chip density is still increasing, but the cost is higher and the time consuming is longer, which is a fundamental change. To this end, OEMs are striving to adopt new methods to extend this cycle and continue to bring stronger processors to the market.” Despite the difficulties, manufacturers of voice chip modules have come up with a relatively new idea - why not adopt a "chip-lets" solution? Small chips are large-scale silicon chips that can be stacked together like Lego blocks, rather than printing the entire circuit on a single chip. Manufacturers can bring a variety of configuration combinations to provide customized multi-chip processors for special tasks such as cloud computing or machine learning. In fact, both AMD and Intel believe that the industry should move in this direction. Because it allows them to ship processors faster and more powerful.

   Ramone Naivety, Intel's senior chief engineer, said it was an evolution of Moore's law. At present, the minimal process of transistor and chip manufacturing is complex and expensive. Small chips provide a way to continue building powerful processors while reducing costs and defects. The newest, best and smallest transistors are very difficult to design and manufacture, and the cost is quite high. On processors consisting of small chips, this cutting-edge technology can retain investment in the most effective design components. Other small chips can be manufactured using more reliable, mature and low-cost technologies, and smaller silicon wafers themselves are not prone to manufacturing defects. AMD has tested this method on last year's EPYC server processor, which consists of four small chips. AMD engineers expect their manufacturing costs to double in an instant if they try to produce them as a single large chip. EPYC's success is obvious. Earlier this week, AMD announced that it would produce a second-generation EPYC server, which contains 64 cores made up of eight sound chip modules.

   On the other hand, Intel has been committed to modular design concept. It is designed for notebook computers processors, there is a customized verification module with AMD cooperation. The chip has been used in Hewlett Packard and Dell brand notebooks. Interestingly, the Pentagon is also interested in this new approach and will invest $1.5 billion in research through the Defense Department's Advanced Research Projects Agency (DARPA).